| GENERAL CHARACTERISTICS ITEM DESCRIPTION | MODULE SHALL BE AN ENCAPSULATED ASSEMBLY,RESISTORS,CARBON SHALL BE PER MIL-R-39008,RESISTORS,METAL FILM PER MIL-R-10509,RESISTORS,WIREWOUND PER MIL-R-93,DIODES AND TRANSISTORS PER MIL-S-19500,MICROELECTRONIC CIRCUITS FROM DEVICE FAMILIES PREVIOUSLY USED IN MILITARY APPLICATIONS,PINS SHALL BE SOLDERABLE PER MIL-STD-202,METHOD 208,PINS SHALL BE BRASS PER QQ-B-626,COMPOSITION 22,PIN PLATING SHALL BE ELECTRO-SOLDER PER MIL-F-14072,M222,ENVIRONMENTAL CONDITIONS AFTER ENCAPSULATION: SHOCK PER MIL-STD-202,METHOD 213,TEST CONDITION J,VIBRATION PER MIL-STD-202,METHOD 201,2.170 IN. O/A LG,1.535 IN. O/A W,1.240 IN. O/A H |