| DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.100 |
| BODY HEIGHT | 0.020 INCHES MINIMUM AND 0.026 INCHES MAXIMUM |
| BODY LENGTH | 0.118 INCHES MINIMUM AND 0.126 INCHES MAXIMUM |
| BODY STYLE | CHIP TYPE |
| BODY WIDTH | 0.057 INCHES MINIMUM AND 0.065 INCHES MAXIMUM |
| CAPACITANCE VALUE PER SECTION | 1000.000 PICOFARADS SINGLE SECTION |
| CASE MATERIAL | CERAMIC |
| INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 10000.0 MEGOHMS |
| INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| III TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 0.0 SINGLE SECTION |
| PROPRIETARY CHARACTERISTICS | PACS |
| NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
| NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| RELIABILITY INDICATOR | NOT ESTABLISHED |
| SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| TERMINAL LENGTH | 0.009 INCHES MINIMUM AND 0.025 INCHES MAXIMUM |
| TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -30.0/+30.0 SINGLE SECTION |
| TOLERANCE RANGE PER SECTION | -10.00/+10.00 PERCENT SINGLE SECTION |