| DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 2.500 |
| BODY HEIGHT | 0.067 INCHES NOMINAL |
| BODY LENGTH | 0.126 INCHES NOMINAL |
| BODY STYLE | CHIP TYPE |
| BODY WIDTH | 0.098 INCHES NOMINAL |
| CAPACITANCE VALUE PER SECTION | 0.220 MICROFARADS SINGLE SECTION |
| CASE MATERIAL | CERAMIC |
| INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 10000.0 MEGOHMS |
| INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| PROPRIETARY CHARACTERISTICS | PACS |
| NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 25.0 DC SINGLE SECTION |
| NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| RELIABILITY INDICATOR | NOT ESTABLISHED |
| SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| VOLTAGE TEMP LIMITS PER SECTION IN PERCENT CAPACITANCE CHANGE | -15.0/+15.0 WITHOUT VOLTAGE APPLIED SINGLE SECTION |
| TERMINAL LENGTH | 0.020 INCHES NOMINAL |
| TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TOLERANCE RANGE PER SECTION | -10.00/+10.00 PERCENT SINGLE SECTION |