5910-00-936-4822 CAPACITOR,FIXED,ELECTROLYTIC Index 4730-00-936-4828 ELBOW,PIPE TO TUBE

National Stock Number:
5935-00-936-4825

Federal Supply Class:
5935

National Item Identification Number:
009364825

Description:
SOCKET,PLUG-IN ELECTRONIC COMPON

Detail:
An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. It includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. Excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. Also excludes heat-dissipating (not heat-sinks) sockets for mounting power transistors.


Manufacturer Information:
1115374218876U S ARMY AVIATION AND MISSILE COMMAND
13699-X96762ELECTRONIC RESEARCH ASSOCIATES INC TRANSPAC POWER SUPPLY DIV
2062293G00128527L3HARRIS TECHNOLOGIES, INC.
2062293REVB28527L3HARRIS TECHNOLOGIES, INC.
33819156232LOCKHEED MARTIN CORPORATION
61651-122525INSTRUMENTS AND FLIGHT RESEARCH INC.
69012-052328499CHEMLEC PRODUCTS INC
8058-1G2500779TE CONNECTIVITY CORPORATION
8058-1G2591506AUGAT INC
8058-1G300779TE CONNECTIVITY CORPORATION
8058-1G7REV200779TE CONNECTIVITY CORPORATION
8058-1G7REV291506AUGAT INC


Techincal Specification:
CONTACT POSITION ARRANGEMENT STYLECIRCULAR IRREGULAR 0.200 INCH
ACCOMMODATED CONTACT QUANTITY3
TERMINAL TYPE AND QUANTITY3 SOLDER STUD
BODY STYLETOP MOUNT, PRESS FIT
CONTACT MATERIALBERYLLIUM COPPER
CONTACT SURFACE TREATMENTGOLD AND
NICKEL
OVERALL HEIGHT0.452 INCHES NOMINAL
OVERALL DIAMETER0.406 INCHES MAXIMUM
PROJECTION LENGTH ABOVE MOUNTING SURFACE0.046 INCHES MINIMUM AND
0.078 INCHES MAXIMUM
BODY MATERIALPLASTIC
MOUNTING TYPE FOR WHICH DESIGNEDCHASSIS
MOUNTING METHODPRESS FIT
MOUNTING HOLE STYLEROUND, BODY
BODY MOUNTING HOLE ACCOMMODATION DIAMETER0.366 INCHES MINIMUM AND
0.369 INCHES MAXIMUM
POLARIZATION TYPECONTACT POSITION
SPECIFIC EQUIPMENT ACCOMMODATEDSEMICONDUCTOR DEVICE
FABRICATION METHODMOLDED
PRECIOUS MATERIALGOLD
PRECIOUS MATERIAL AND WEIGHT0.015 GOLD GRAINS, TROY
PRECIOUS MATERIAL AND LOCATIONCONTACT SURFACES GOLD


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