COMPONENT FUNCTION RELATIONSHIP | MATCHED |
COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
FEATURES PROVIDED | HERMETICALLY SEALED CASE AND ELECTROSTATIC SENSITIVE |
MATERIAL | CERAMIC ENCLOSURE ALL SEMICONDUCTOR DEVICE DIODE |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 95.0 CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE |
MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
OVERALL DIAMETER | 0.228 INCHES MINIMUM AND 0.232 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
OVERALL LENGTH | 0.750 INCHES MINIMUM AND 0.790 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
SEMICONDUCTOR MATERIAL | SILICON OR GERMANIUM ALL SEMICONDUCTOR DEVICE DIODE |
TERMINAL TYPE AND QUANTITY | 2 PIN ALL SEMICONDUCTOR DEVICE DIODE |