1680-00-307-4748 SHAFT AND GEAR ASSE Index 1680-00-307-4750 GEAR ASSEMBLY,ACTUA

National Stock Number:
5961-00-307-4749

Federal Supply Class:
5961

National Item Identification Number:
003074749

Description:
SEMICONDUCTOR DEVICES,UNITIZED

Detail:
Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.


Manufacturer Information:
1155362118876U S ARMY AVIATION AND MISSILE COMMAND
115536213B150RAYTHEON COMPANY
FSA2565M07263FAIRCHILD SEMICONDUCTOR CORP
GM820ADD126512NORTHROP GRUMMAN SYSTEMS CORPORATION
FSA2565M27014NATIONAL SEMICONDUCTOR CORPORATION
1155362149956RAYTHEON COMPANY


Techincal Specification:
COMPONENT NAME AND QUANTITY13 SEMICONDUCTOR DEVICE DIODE
CURRENT RATING PER CHARACTERISTIC350.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC ALL SEMICONDUCTOR DEVICE DIODE
FEATURES PROVIDEDHERMETICALLY SEALED CASE
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATIONTO-116
OVERALL HEIGHT0.200 INCHES MAXIMUM
OVERALL LENGTH0.640 INCHES MINIMUM AND 0.736 INCHES MAXIMUM
OVERALL WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
MATERIALPLASTIC ENCLOSURE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 CELSIUS AMBIENT AIR
MOUNTING METHODTERMINAL
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN
POWER RATING PER CHARACTERISTIC600.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE
SEMICONDUCTOR MATERIALSILICON ALL SEMICONDUCTOR DEVICE DIODE
TERMINAL LENGTH0.125 INCHES MINIMUM AND 0.200 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY14 PIN
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC55.0 MAXIMUM REVERSE VOLTAGE, PEAK ALL SEMICONDUCTOR DEVICE DIODE


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