| MOUNTING FACILITY QUANTITY | 2 |
| OVERALL HEIGHT | 0.762 INCHES NOMINAL |
| OVERALL WIDTH | 1.050 INCHES MAXIMUM |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND |
| HERMETICALLY SEALED CASE |
| TEST DATA DOCUMENT | 18876-13153395 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| SEMICONDUCTOR MATERIAL | SILICON |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 350.0 MAXIMUM DRAIN TO SOURCE VOLTAGE AND |
| 20.0 NOMINAL GATE TO SOURCE VOLTAGE |
| CURRENT RATING PER CHARACTERISTIC | 8.00 AMPERES MAXIMUM OFF-STATE CURRENT, PEAK AND |
| 4.00 AMPERES MAXIMUM DARK CURRENT |
| POWER RATING PER CHARACTERISTIC | 75.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| INCLOSURE MATERIAL | METAL |
| TERMINAL TYPE AND QUANTITY | 2 PIN AND |
| 1 CASE |
| OVERALL LENGTH | 1.553 INCHES MINIMUM AND |
| 1.573 INCHES MAXIMUM |
| MOUNTING METHOD | UNTHREADED HOLE |
| INTERNAL CONFIGURATION | FIELD EFFECT |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | T0-3 |