| BODY HEIGHT | 0.025 INCHES MINIMUM AND 0.045 INCHES MAXIMUM |
| BODY LENGTH | 0.260 INCHES MAXIMUM |
| BODY WIDTH | 0.150 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-84 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| FEATURES PROVIDED | PROGRAMMED AND HERMETICALLY SEALED AND BURN IN |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| INPUT CIRCUIT PATTERN | 8 INPUT |
| MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| MEMORY DEVICE TYPE | DIODE MATRIX |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| PRECIOUS MATERIAL | GOLD |
| PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | GOLD |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| TEST DATA DOCUMENT | 96906-MIL-STD-750 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |