| BODY HEIGHT | 0.150 INCHES MAXIMUM |
| BODY LENGTH | 1.175 INCHES MINIMUM AND 1.300 INCHES MAXIMUM |
| BODY WIDTH | 0.490 INCHES MINIMUM AND 0.550 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| FEATURES PROVIDED | BURN IN, MIL-STD-883, CLASS B AND EDGE TRIGGERED AND ERASABLE AND HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
| MEMORY DEVICE TYPE | ROM |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS |
| OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 125.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| TIME RATING PER CHACTERISTIC | 650.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 650.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MAXIMUM POWER SOURCE |