| BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.225 INCHES MAXIMUM |
| BODY LENGTH | 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM |
| BODY WIDTH | 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM |
| FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND W/BUFFERED OUTPUT AND POSITIVE OUTPUTS AND BURN IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
| MEMORY CAPACITY | UNKNOWN |
| MEMORY DEVICE TYPE | ROM |
| OPERATING TEMP RANGE | -40.0 TO 70.0 CELSIUS |
| OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 125.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| TEST DATA DOCUMENT | 86360-515C9506-02 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| TIME RATING PER CHACTERISTIC | 900.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 900.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 0.5 VOLTS MAXIMUM POWER SOURCE |