| BODY HEIGHT | 1.270 MILLIMETERS MINIMUM AND 2.030 MILLIMETERS MAXIMUM |
| BODY LENGTH | 9.420 MILLIMETERS MINIMUM AND 10.160 MILLIMETERS MAXIMUM |
| BODY WIDTH | 6.270 MILLIMETERS MINIMUM AND 7.240 MILLIMETERS MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | 85.00 MILLIAMPERES MAXIMUM SUPPLY |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER, HEX |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
| TIME RATING PER CHACTERISTIC | 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |