BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.130 INCHES MAXIMUM |
BODY LENGTH | 1.090 INCHES MAXIMUM |
BODY WIDTH | 0.450 INCHES MAXIMUM |
FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC AND GLASS |
INPUT CIRCUIT PATTERN | 14 INPUT |
OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 520.0 MILLIWATTS |
MEMORY DEVICE TYPE | RAM |
OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
TEST DATA DOCUMENT | 97942-581R888 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
TIME RATING PER CHACTERISTIC | 180.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 180.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 30.0 VOLTS MAXIMUM POWER SOURCE |