| BODY HEIGHT | 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| BODY LENGTH | 0.890 INCHES MINIMUM AND 0.930 INCHES MAXIMUM |
| BODY WIDTH | 0.280 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| MAXIMUM POWER DISSIPATION RATING | 409.6 MILLIWATTS |
| MEMORY CAPACITY | UNKNOWN |
| MEMORY DEVICE TYPE | ROM |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| OVERALL HEIGHT | 0.350 INCHES MAXIMUM |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |