| BIT QUANTITY | 16384 |
| BODY HEIGHT | 0.210 INCHES NOMINAL |
| BODY LENGTH | 1.290 INCHES MAXIMUM |
| BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| FEATURES PROVIDED | HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND HIGH SPEED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| INPUT CIRCUIT PATTERN | 13 INPUT |
| MAXIMUM POWER DISSIPATION RATING | 635.0 MILLIWATTS |
| MEMORY DEVICE TYPE | ROM |
| OPERATING TEMP RANGE | +0.0 TO 70.0 CELSIUS |
| OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| STORAGE TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| WORD QUANTITY | 2048 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |