| BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| BODY LENGTH | 0.390 INCHES MAXIMUM |
| BODY WIDTH | 0.235 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-2 MIL-M-38510 |
| DESIGN FUNCTION AND QUANTITY | 1 GATE, AND-OR INVERT |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND BURN IN |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| STORAGE TEMP RANGE | -65.0 TO 175.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TEST DATA DOCUMENT | 86360-515C2030-05 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| TIME RATING PER CHACTERISTIC | 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 350.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 18.0 VOLTS MAXIMUM POWER SOURCE |