| BODY HEIGHT | 0.100 INCHES MAXIMUM |
| BODY LENGTH | 0.700 INCHES NOMINAL |
| BODY WIDTH | 0.700 INCHES NOMINAL |
| CURRENT RATING PER CHARACTERISTIC | 91.00 MILLIAMPERES MAXIMUM SUPPLY |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| INCLOSURE CONFIGURATION | BEAM CHIP |
| INCLOSURE MATERIAL | METAL |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| MEMORY DEVICE TYPE | PAL |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| PRECIOUS MATERIAL AND LOCATION | CASE AND TERMINAL SURFACES GOLD |
| PRECIOUS MATERIAL | GOLD |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 64 BEAM LEAD |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 6.1 VOLTS MAXIMUM POWER SOURCE |