BODY HEIGHT | 0.085 INCHES MAXIMUM |
BODY LENGTH | 0.355 INCHES MINIMUM AND 0.395 INCHES MAXIMUM |
BODY WIDTH | 0.355 INCHES MINIMUM AND 0.395 INCHES MAXIMUM |
FEATURES PROVIDED | MONOLITHIC AND W/ENABLE AND HERMETICALLY SEALED AND BURN IN |
INCLOSURE CONFIGURATION | FLAT PACK |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 16 INPUT |
MEMORY DEVICE TYPE | ROM |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 22 FLAT LEADS |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 220.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 220.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 8.3 VOLTS MAXIMUM POWER SOURCE |