| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.190 INCHES MAXIMUM |
| BODY LENGTH | 1.450 INCHES MINIMUM AND 1.470 INCHES MAXIMUM |
| BODY WIDTH | 0.515 INCHES MINIMUM AND 0.570 INCHES MAXIMUM |
| FEATURES PROVIDED | HERMETICALLY SEALED AND ASYNCHRONOUS AND EXPANDABLE AND W/ENABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 13 INPUT |
| OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 420.0 MILLIWATTS |
| MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| STORAGE TEMP RANGE | -55.0 TO 150.0 CELSIUS |
| TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -20.0 VOLTS MINIMUM POWER SOURCE AND 0.0 VOLTS MAXIMUM POWER SOURCE |