| BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| BODY LENGTH | 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| BODY WIDTH | 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM |
| CASE OUTLINE SOURCE AND DESIGNATOR | MO-004AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| DESIGN FUNCTION AND QUANTITY | 4 BUFFER, NAND |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/TOTEM POLE OUTPUT AND POSITIVE OUTPUTS |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| MAXIMUM POWER DISSIPATION RATING | 10.0 MILLIWATTS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |