BODY HEIGHT | 0.070 INCHES MINIMUM AND 0.135 INCHES MAXIMUM |
BODY LENGTH | 1.440 INCHES MINIMUM AND 1.490 INCHES MAXIMUM |
BODY WIDTH | 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM |
FEATURES PROVIDED | STATIC OPERATION AND HIGH PERFORMANCE AND 3-STATE OUTPUT AND HIGH RELIABILITY |
INCLOSURE CONFIGURATION | DUAL-IN-LINE |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 25 INPUT |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
MEMORY DEVICE TYPE | RAM |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
TERMINAL SURFACE TREATMENT | SOLDER |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |