BODY HEIGHT | 0.117 INCHES MINIMUM AND 0.137 INCHES MAXIMUM |
BODY LENGTH | 1.088 INCHES MINIMUM AND 1.112 INCHES MAXIMUM |
BODY WIDTH | 1.088 INCHES MINIMUM AND 1.112 INCHES MAXIMUM |
DESIGN FUNCTION AND QUANTITY | 1 ARRAY, LOGIC |
FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK AND POSITIVE OUTPUTS AND ERASABLE |
INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 64 INPUT |
MAXIMUM POWER DISSIPATION RATING | 1500.0 MILLIWATTS |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 68 LEADLESS |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -2.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |