BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM |
BODY LENGTH | 0.740 INCHES MAXIMUM |
BODY WIDTH | 0.340 INCHES MINIMUM AND 0.380 INCHES MAXIMUM |
CASE OUTLINE SOURCE AND DESIGNATOR | F-11 MIL-M-38510 |
FEATURES PROVIDED | CASCADABLE AND MONOLITHIC AND W/RESET |
INCLOSURE CONFIGURATION | FLAT PACK |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 12 INPUT |
OVERALL WIDTH | 0.840 INCHES MINIMUM AND 1.120 INCHES MAXIMUM |
MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 28 FLAT LEADS |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |