DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
BODY HEIGHT | 0.067 INCHES MINIMUM AND 0.083 INCHES MAXIMUM |
BODY LENGTH | 1.086 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
BODY WIDTH | 1.086 INCHES MINIMUM AND 1.110 INCHES MAXIMUM |
FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/CLOCK |
INCLOSURE CONFIGURATION | CAN |
INCLOSURE MATERIAL | CERAMIC |
INPUT CIRCUIT PATTERN | 29 INPUT |
PROPRIETARY CHARACTERISTICS | PACS |
OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.0 VOLTS MAXIMUM POWER SOURCE |
STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
TERMINAL SURFACE TREATMENT | SOLDER |
TERMINAL TYPE AND QUANTITY | 68 PIN |
TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |