| BODY HEIGHT | 2.16 MILLIMETERS MINIMUM AND 3.68 MILLIMETERS MAXIMUM |
| BODY LENGTH | 29.98 MILLIMETERS MINIMUM AND 30.98 MILLIMETERS MAXIMUM |
| FEATURES PROVIDED | HERMETICALLY SEALED AND 3-STATE OUTPUT AND PROGRAMMABLE AND MONOLITHIC AND STATIC OPERATION |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| PROPRIETARY CHARACTERISTICS | PACS |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OVERALL WIDTH | 14.74 MILLIMETERS MINIMUM AND 15.74 MILLIMETERS MAXIMUM |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 15.0 VOLTS MAXIMUM POWER SOURCE |
| STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |