| BIT QUANTITY | 1024000 |
| BODY HEIGHT | 0.285 INCHES MAXIMUM |
| BODY LENGTH | 1.560 INCHES MINIMUM AND 1.640 INCHES MAXIMUM |
| BODY WIDTH | 0.610 INCHES NOMINAL |
| CURRENT RATING PER CHARACTERISTIC | 5.00 MILLIAMPERES MAXIMUM OUTPUT |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND BIDIRECTIONAL |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 28 INPUT |
| OVERALL HEIGHT | 0.500 INCHES MAXIMUM |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MEMORY MODULE ASSEMBLY |
| MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
| MEMORY DEVICE TYPE | EEPROM |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| WORD QUANTITY | 128000 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 32 PRINTED CIRCUIT |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM ACCESS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -500.0 MILLIVOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |