| DESIGN FUNCTION AND QUANTITY | 1 MICROPROCESSOR |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HIGH SPEED AND LOW POWER AND HIGH PERFORMANCE |
| INCLOSURE CONFIGURATION | PIN GRID ARRAY |
| INCLOSURE MATERIAL | CERAMIC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | CMOS 32-BIT HIGH-SPEED MICROPROCESS SLICE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 101 PRINTED CIRCUIT |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS NOMINAL ACCESS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.6 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |