| BODY HEIGHT | 0.110 MILLIMETERS MAXIMUM |
| BODY LENGTH | 0.620 MILLIMETERS MINIMUM AND 0.630 MILLIMETERS MAXIMUM |
| BODY WIDTH | 0.291 MILLIMETERS MINIMUM AND 0.299 MILLIMETERS MAXIMUM |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER, TRI-STATE |
| FEATURES PROVIDED | 3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE AND HIGH IMPEDANCE |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| INCLOSURE MATERIAL | PLASTIC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | 16-BIT BUFFER/DRIVERS WITH 3-STATE |
| MAXIMUM POWER DISSIPATION RATING | 94.0 WATTS |
| OPERATING TEMP RANGE | -40.0 TO 85.0 CELSIUS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 48 GULLWING |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |