| GENERAL CHARACTERISTICS ITEM DESCRIPTION | FLEXIBLE CIRCUIT TO LAMINATED USING 2 OZ COPPER WITH .001 THICK POLYAMID /KAPTON H/,LAMINATES TO BE BONDED USING THERMOSETTING EPOXY ADHESIVE OR EQUAL TOTAL THICKNESS TO BE .015 MAX,5 3/16 IN. LG,3.1/32 IN. WIDTH,4 CORNERS 1/8 X 45 DEG |